+ Wedge, Ball, Bump and Ribbon bonding
+ 17u to 75u Wire and 25u x 250u Ribbon
+ 4,3” TFT Display & Multi Button
+ Deep-Access Wedge 16mm / Ball 13mm
+ Bond Arm Length 165mm
+ Motorized Tail Control
+ 20 Program Storage Capacities
+ Electronic Ball Size Control

HB05 Thermosonic Wire Bonder for Wedge & Ball Bonding

The HB05 is a Bench Top Size Wire Bonder, ideal for laboratories and pilot production lines.
One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT Display, direct access and simple adjustment of all bond parameters.

Technical Specifications

Bonding Methode Gold wire diameter Aluminium wire diameter Ribbon size Ultrasonic system Utrasonic power Bond time Bond force Bonding tool Motorised Wire Spool Wire termination Wire feed angle Clamp movement Ball size control Throat depth Fine Table motion Mouse ratio Temperature controller Electrical Requirements Physical Dimensions Weight Industry Standards

Wedge-Wedge, Ball-Wedge, Ribbon- & Bumb- bonding 17-75u (0,7-3 mil) 17-75u (0,7-3 mil) max. 25 x 250u (1x 8 mil) 62 kHz Transducer PLL Control 0-5 Watt Output 0 - 1 sec. 5-130 cNm 1,58 ? 19 mm length (0,0624” x 0,750") 50,8 mm ( 2") Bond Head Tear 90° Motorized, Up / Down Electronic 165 mm ( 6,7") 10 mm ( 0,4") 6:1 up to 250°C +/- 1°C 100 - 240V +/-10% 50/60 Hz 10A max. 550 x 450 x 250mm Net 25 kg CE standards