+ Wedge, Ball, Bump and Ribbon bonding
+ 17u to 75u Wire and 25u X 250u Ribbon
+ 6,5" TFT Touch Screen
+ Deep-Access Bond Head 16mm
+ Bond Arm Length 165mm
+ 100 Program Storage Capacities
+ Motorized Z-Axis
+ USB Backup
+ Electronic Ball Size Control

+ Pick & Place Option
+ Pull Tester Option
+ Copper Bonding Option

HB10 Thermosonic Wire Bonder for Wedge & Ball Bonding

The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT Touch Screen, direct access and simple adjustment of all bond parameters.

Technical Specifications

Bonding Methode Gold wire diameter Aluminium wire diameter Ribbon size Ultrasonic system Utrasonic power Bond time Bond force Bonding tool Motorised Wire Spool Wire termination Wire feed angle Clamp movement Ball size control Motorized Z travel Throat depth Fine Table motion Mouse ratio Temperature controller Electrical Requirements Physical Dimensions Weight Industry Standards

Wedge-Wedge, Ball-Wedge, Ribbon- & Bumb- bonding 17-75u (0,7-3 mil) 17-75u (0,7-3 mil) max. 25 x 250u (1x 8 mil) 62 kHz Transducer PLL Control 0-5 Watt Output 0 - 10 sec. 5-150 cNm (350cNm option) 1,58 ? 19 mm length (0,0624” x 0,750") 50,8 mm ( 2") Bond Head Tear / CLamp Tear 90° Motorized, Up / Down Electronic 17mm (0,67") 165 mm ( 6,7") 10 mm ( 0,4") 6:1 up to 250°C +/- 1°C 100 - 240V +/-10% 50/60 Hz 10A max. 680 (27")x 640 (25") x 490mm (19") Net 42 kg CE standards