+ 100u to 500u Aluminium Wire
+ 6,5" TFT Touch Screen
+ 100 Program Storage Capacities
+ Built in Dual Fiber Optic illuminator
+ Motorised Z Bond Head
+ Motorized Y travel for Step-Back loop control
+ 6:1 ratio X-Y manipulator
+ Loop Profile Programmable
+ Stitch bonding
+ Semi-auto, Step and Manual Bonding Mode

HB30 Heavy Wire Bonder

The HB30 is a bench top size wire bonder, ideal for laboratories, pilot and pre-production runs and small scale production tines. Easy operation with TFT Touch Screen Operator System. Direct access and simple adjustment to all bond parameters and programs.

Technical Specifications

Ultrasonic system Utrasonic power Bond time Bond force Aluminium wire diameter Wire termination Wire feed angle Motorized Y travel Motorized Z travel Fine Table motion Mouse ratio Electrical Requirements Physical Dimensions Weight Industry Standards

PLL US System 50 Watt Output 0-10 sec. 50 - 1500cN 100u to 500u Front Cut 90° Stepback up to 17 mm 20 mm 15 mm 6:1 ( Option 3:1 ) 100 - 240V +/-10% 50/60 Hz 10A max. 680 mm ( 27”)W x 640 mm (25") D x 490 mm ( 19”) H Net 50 kg CE Standards