8000i Wire Bonder Overview
The 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

The 8000i comes equipped with Intelligent Interactive Graphical InterfaceTM (i2GiTM), a revolutionary software capability for modern wire bonding.

CYCLE TIME
0.125 sec/wire; 0.077 sec/bump

PLACEMENT ACCURACY
+/- 2.5 micron, 3 sigma

LARGE WORK AREA
304.8 x 152.4 mm (12 x 6 inch)

MULTIPLE FEATURES
? Tailless bump mode
? Stand-off stitch wires
? Cognex video
? One-step planar gold bumps
? Tall multi-level bonding (>12.7mm, >0.50 inch)
? Chain bonding
? TAB bonding
? Adaptive bond deformation
? True perpendicular bonding to consistently produce high-quality bonds at varying surface heights over a 20mm range (0.78 inch)

VERSATILITY
? Wire bonder and ball bumper
? Deep access with capillary of 11.10-19.05mm (0.437-0.75 inch) capillaries available
? In-line and magazine handlers
? SMEMA compatible

BOND DATA MINERTM
comprehensive and centralized data management and analysis system
? Aggregates run data into timestamped data sets
? Process analysis tool
? Machine and process trends monitoring for increased yields and predictive maintenance

COMMON APPLICATIONS
? Large Complex Hybrids
? System in Packages (SiPs)
? Multi-Chip Modules (MCMs)
? Automotive Assemblies
? LEDs with Running Stitch
? Disk Drive Assemblies
? Flex Circuits
? HB/HP LED Arrays
? Optoelectronic Packaging
? Chip on Board (COB)
? Solar Concentrator Packaging
? Specialty Lead Frames
? Fine Pitch Devices

The 8000i Wire Bonder data sheet:
Download the 8000i Wire Bonder data sheet